The importance of computer architecture in microprocessor thermal design

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2, Issue , 2004, Pages 729-730

  Skadron, Kevin ^a  

^a University of Virginia   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY- AND INITIAL-CONDITION INDEPENDENT (BICI); DYNAMIC THERMAL MANAGEMENT (DTM); INFRARED CAMERA; STRESS CRACKING;

CAMERAS; CARRIER MOBILITY; COMPUTER HARDWARE; COOLING; ELECTRIC POWER UTILIZATION; ELECTROMIGRATION; INFRARED DEVICES; INTEGRATED CIRCUITS; MICROPROCESSOR CHIPS; THERMAL EFFECTS; VLSI CIRCUITS;

COMPUTER ARCHITECTURE;

EID: 4444304779     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

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6. M. R. Stan, K. Skadron, M. Barcella, W. Huang, K. Sankaranarayanan, and S. Velusamy. Hotspot: A dynamic compact thermal model at the processor-architecture level. Microelectronics Journal: Circuits and Systems, 34(12): 1153-65, Dec. 2003.