Top coat or no top coat for immersion lithography?

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6153 I, Issue , 2006, Pages

  Stepanenko, N ^a,b   Kim, Hyun Woo ^a,c   Kishimura, S ^a,d   Van Den Heuvel, D ^a   Vandenbroeck, N ^a   Kocsis, M ^a,e   Foubert, P ^a   Maenhoudt, M ^a   Ercken, M ^a   Van Roey, F ^a   Gronheid, R ^a   Pollentier, I ^a   Vangoidsenhoven, D ^g   Delvaux, C ^a   Baerts, C ^a   O'Brien, S ^f   Fyen, W ^a   Wells, G ^a,f  

^a IMEC   (Belgium)

^b INFINEON TECHNOLOGIES AG   (Germany)

^c SAMSUNG Electronics   (South Korea)

^d PANASONIC CORPORATION   (Japan)

^e INTEL CORPORATION   (United States)

^f TEXAS INSTRUMENTS   (United States)

^g NONE

Author keywords

Contact angle; Defects; Immersion lithography; Intermixing layer; Leaching; Scan speed; Top coat; Water uptake

Indexed keywords

COATINGS; CONTACT ANGLE; DEFECTS; LEACHING; MASS SPECTROMETERS; QUARTZ; SCANNING;

IMMERSION LITHOGRAPHY; INTERMIXING LAYERS; SCAN SPEED; TOP COAT; WATER UPTAKE;

LITHOGRAPHY;

EID: 33745590729     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.660158     Document Type: Conference Paper

References (16)

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