Double-frame silicon gyroscope packaged under low pressure by wafer bonding

IEEJ Transactions on Sensors and Micromachines

Volumn 120, Issue 3, 2000, Pages 111-115

  Kobayashi, Shinji ^a   Ohwada, Kuniki ^a   Hara, Tetsuzo ^a   Oguchi, Takahiro ^a   Asaji, Yasushi ^a   Yaji, Kaneo ^a  

^a Murata Mfg Ltd   (Japan)

Author keywords

gyroscope; micrornadiining bonding; resonator; silioon

Indexed keywords

EID: 0006895431     PISSN: 13418939     EISSN: 13475525     Source Type: Journal    
DOI: 10.1541/ieejsmas.120.111     Document Type: Article

References (9)

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