Microstructure gradient in 60Sn40Pb solder joints annealed under an external electric field

Journal of Materials Science

Volumn 39, Issue 5, 2004, Pages 1803-1804

  Jung, K ^a   Conrad, H ^a  

^a North Carolina State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; DIFFUSION; ELECTRIC CHARGE; ELECTRIC FIELD EFFECTS; ELECTROMIGRATION; GRAIN BOUNDARIES; MICROSTRUCTURE; OXIDES; POROSITY; SOLUBILITY; TIN ALLOYS;

COARSENING; ELECTROCHEMICAL POTENTIALS; ELECTRON WINDS;

SOLDERED JOINTS;

EID: 1842430921     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1023/B:JMSC.0000016189.01285.35     Document Type: Article

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