Electromigration induced metal dissolution in flip-chip solder joints

Materials Science Forum

Volumn 475-479, Issue IV, 2005, Pages 2655-2658

  Lin, Y H ^a   Tsai, C M ^a   Hu, Y C ^a   Lin, Y L ^a   Tsai, J Y ^a   Kao, C R ^a  

^a NATIONAL CENTRAL UNIVERSITY   (Taiwan)

Author keywords

Electromigration; Flip chip; Solder; Thermomigration

Indexed keywords

CURRENT DENSITY; ELECTRIC RESISTANCE; ELECTROMIGRATION; HEAT SINKS; SCANNING ELECTRON MICROSCOPY; SUBSTRATES; THERMAL CONDUCTIVITY;

FLIP-CHIP; HEAT SOURCES; JOULE HEATING; THERMOMIGRATION;

SOLDERED JOINTS;

EID: 17044413733     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/0-87849-960-1.2655     Document Type: Conference Paper

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