MEMS & MOEMS reliability : Wafer-level packaging and low-temperature processing issues

Proceedings of WFOPC2005 - 4th IEEE/LEOS Workshop on Fibres and Optical Passive Components

Volumn 2005, Issue , 2005, Pages 75-88

  Weiss, P ^a  

^a Colibrys SA ^*  (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

CONTAMINATION; ELECTRIC DISCHARGES; ELECTRONICS PACKAGING; ELECTROSTATICS; OPTICAL DEVICES; SILICON WAFERS;

ELECTROSTATIC DISCHARGES; INDUSTRIAL PRODUCTS; PARTICLE CONTAMINATION; WAFER LEVEL (WL) PACKAGING;

MICROELECTROMECHANICAL DEVICES;

EID: 33744982452     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/WFOPC.2005.1462104     Document Type: Conference Paper

References (21)

1. M. Cadman, A Perret, F. Porret, R. Vuilleumier, and P. Weiss, "New Micromechanical Display Using Thin Metallic Films", IEEE Electron Device Letters, vol. 4, 1983, p. 3
2. M. R. Douglass, "DMD reliability: A Success Story", Proceedings of SPIE, Vol. 4980, 2003
3. C. Marxer and N. F. de Roij, "Micro-Opto-Mechanical 2×2 Switch for Single-Mode Fibers Based on Plasma-Etched Silicon Mirror and Electrostatic Actuation", Journal of Lightwave Technology, Vol. 17, 1, 1999, p. 2
4. R. Vuilleumier and K. Kraiczek, "Variable Entrance Slit System for Precision Spectrophotometers", Sensors and Actuators Vol. A50, 1995, p. 87
5. N. Takeda, "Ball Semiconductor Technology and its Application to MEMS", Proceedings of the MEMS Conference, Miyazaki, 2000. p.11
6. e. g. XISE 300d, by XSIL, www.xsil.com
7. See e. g. "Sony Quality and Reliability Handbook", http://www.sony.net/Products/SC-EP/tec/catalog/pdf/qr_all.pdf
8. C. Mastrangelo, "The Suppression of Stiction in MEMS", MSR Spring Meeting, Boston, 1999
9. W Merlijn van Spengen, R. Puers, and I. de Wolf, "A Physical Model to Predict Stiction in MEMS", J. Micromech. Microeng, Vol. 12, 2002, p. 702
10. A. Sontheimer, "Digital Miromirror Device (DMD) Hinge Memory Lifetime Reliability Modelling ", Proceedings of the IRPS, Dallas, 2002, p. 118
11. J. Walraven, "Failure mechanisms in MEMS", Proceedings of the ITC, Charlotte, 2003, p. 828
12. D. Tanner et al., "The Effect of Humidity on the Reliability of a Surface Micromachined Microengine", Proceedings of the IRPS, San Diego, 199, p. 189
13. F. Gueissaz and D. Piguet, "The Microreed, an Ultrasmall Passive MEMS Magnetic Proximity Sensor Designed for portable Applications", ", Proceedings of the MEMS Conference, 2001, Interlaken. p. 269
14. J. Rabek, "Photodegradation of Polymers: Physical Characteristics and Applications", Springer Verlag, 1996
15. J Walraven, "Future challenges for MEMS Failure Analyses", Proceedings of the ITC, Charlotte, 2003, p. 850
16. H. Shea et al., "Effects of Electrical Leakage Currents on MEMS Reliability and Performance", IEEE trans. Dev. Mat. Rel., Vol 4, 2004, p. 198
17. P. Voumard, Ph. Debergh, G. Perregaux, and S. Gonseth, "Anodic Oxidation in Polysilicon Microactuators", Proceedings of the SPIE, Vol. 4019, 2000, p.568
18. L. Lin, K. McNair, R. Howe, and A. Pisano, "Vacuum Encapsulated Lateral Microresonators", Proceeding of the Transducers Conference, Stockholm, 1995, p.225
19. P. Monajemi, P. Joseph., P. Kohl, and F. Ayazi, "A Low Cost Wafer-Level MEMS Packaging Technology", Proceedings of the MEMS Conference, 2005, Miami, p. 634
20. th Workshop on Semiconductor Wafer Bonding, Paris, 2003, p. 49
21. G. Perregaux, S. Gonseth, P. Debergh, J.P. Thiébaud, and H. Vuillomenet, "Arrays of Addressable High-speed Microshutters", proceedings of the MEMS conference, Interlaken, 2001, p. 232