Materials & process technology: Materials

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn , Issue , 2000, Pages 1-6

  Estes, Richard H ^a  

^a Polymer Flip Chip Corp   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

SOLDER BUMPS; THERMODES; UNDERFILL MATERIALS;

CONDUCTIVE PLASTICS; CURING; ELECTRONICS PACKAGING; ENCAPSULATION;

FLIP CHIP DEVICES;

EID: 0033700391     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)