Low-cost direct chip attach: comparison of SMD compatible FC soldering with anisotropically conductive adhesive FC bonding

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 23, Issue 1, 2000, Pages 12-18

  Haug, Ralf ^a   Behner, Ulrich ^a   Czaya, Claus Peter ^a   Jiang, Hongquan ^a   Kotthaus, Stefan ^a   Schuetz, Reiner ^a   Treutler, Christoph P O ^a  

^a ROBERT BOSCH GMBH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; ANISOTROPY; ELECTRIC CURRENTS; ELECTRIC RESISTANCE; FILLER METALS; FLIP CHIP DEVICES; METALLIZING; SOLDERING; SPURIOUS SIGNAL NOISE; SURFACE MOUNT TECHNOLOGY; THERMAL CYCLING;

ANISOTROPICALLY CONDUCTIVE ADHESIVE; CONTACT RESISTANCE; EUTECTIC SOLDER BUMPS; NOISE SPECTRUM; SURFACE MOUNT DEVICES; UNDER BUMP METALLIZATION;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0033751762     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/6104.827521     Document Type: Article

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