Leading indicators of failure for prognostication of leaded and lead-free electronics in harsh environments

Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005

Volumn PART B, Issue , 2005, Pages 1535-1543

  Lall, Pradeep ^a   Islam, Nokibul ^a   Choudhary, Prakriti ^a   Suhling, Jeff ^a  

^a AUBURN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; FAILURE ANALYSIS; MICROELECTROMECHANICAL DEVICES; SOLDERED JOINTS; THERMOMECHANICAL TREATMENT;

ELECTRONIC COMPONENTS; LEAD-FREE ELECTRONICS; PROGNOSTICATION;

ELECTRONIC EQUIPMENT;

EID: 32844459679     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/ipack2005-73426     Document Type: Conference Paper

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