Single-run single-mask inductively-coupled-plasma reactive-ion-etching process for fabricating suspended high-aspect-ratio microstructures

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 45, Issue 1 A, 2006, Pages 305-310

  Yang, Yao Joe ^a   Kuo, Wen Cheng ^a   Fan, Kuang Chao ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

Bulk micromachining; Deep reactive ion etching (DRIE); High aspect ratio structure (HARS); Inductively coupled plasma (ICP); Suspended microstructures

Indexed keywords

ASPECT RATIO; INDUCTIVELY COUPLED PLASMA; MASKS; MICROSTRUCTURE; POLYMERS; SILICON WAFERS;

BULK MICROMACHINING; DEEP REACTIVE ION ETCHING (DRIE); HIGH-ASPECT-RATIO-STRUCTURES (HARS); SINGLE-RUN SINGLE-MASK (SRM) PROCESSES; SUSPENDED MICROSTRUCTURES;

REACTIVE ION ETCHING;

EID: 31544455554     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.45.305     Document Type: Article

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