Reactive ion etching for high aspect ratio silicon micromachining

Surface and Coatings Technology

Volumn 97, Issue 1-3, 1997, Pages 140-150

  Rangelow, I W ^a  

^a UNIVERSITY OF KASSEL   (Germany)

Author keywords

Lithography; MEMS; RIE

Indexed keywords

ANISOTROPY; ASPECT RATIO; ION BEAM LITHOGRAPHY; MICROELECTROMECHANICAL DEVICES; MICROELECTRONIC PROCESSING; MICROMACHINING; QUARTZ; SEMICONDUCTING SILICON; SUBSTRATES;

DEEP STRUCTURING;

REACTIVE ION ETCHING;

EID: 0031359494     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0257-8972(97)00284-3     Document Type: Article

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