An additive micromolding approach for the development of micromachined ceramic substrates for RF applications

Journal of Microelectromechanical Systems

Volumn 13, Issue 3, 2004, Pages 514-525

  Vaed, Kunal ^a   Florkey, John ^a   Akbar, Sheikh A ^a   Madou, Mark J ^a   Lannutti, John J ^a   Cahill, Sean S ^b  

^a OHIO STATE UNIVERSITY   (United States)

^b BridgeWave Communications   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; DIMENSIONAL STABILITY; DRY ETCHING; ELECTROPLATING; GLASS CERAMICS; PHOTOLITHOGRAPHY; PROFILOMETRY; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING SILICON; SUBSTRATES; TRANSFER MOLDING; TRANSMISSION LINE THEORY;

ADDITIVE MICROMOLDING APPROACH; ANISOTROPIC SILICON ETCHING; CERAMIC MICROMACHINING; LOW TEMPERATURE COFIRED CERAMIC TAPES; RADIO FREQUENCY APPLICATIONS; SURFACE PROFILER;

MICROELECTROMECHANICAL DEVICES;

EID: 3142781354     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2004.828737     Document Type: Article

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