A thermal aging study on both Au-Cu and Au-Al wire-bonded interfaces

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 1761-1766

  Lee, Chu Chung ^a   Tran, Tu Anh ^a   Yong, Lois ^a   Harun, Fuaida ^b   Yong, C C ^b  

^a MOTOROLA INC   (United States)

^b Motorola Malaysia Sdn Bhd   (Malaysia)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; ALUMINUM; BONDING; COPPER; DEGRADATION; ELECTRONICS PACKAGING; FAILURE (MECHANICAL); GOLD; INTERMETALLICS; MATERIALS TESTING; OXIDATION; RELIABILITY;

GOLD WIRE BALL BONDING PROCESS; PACKAGE LEVEL RELIABILITY; TIME DEPENDENT THERMAL AGING TEST; WIRE BONDED INTERFACES;

INTERFACES (MATERIALS);

EID: 0038349670     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

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