Development of a Thermosonic Wire-Bonding Process for Gold Wire Bonding to Copper Pads Using Argon Shielding

Journal of Electronic Materials

Volumn 33, Issue 4, 2004, Pages 300-311

  Aoh, Jong Ning ^a   Chuang, Cheng Li ^a  

^a NATIONAL CHUNG CHENG UNIVERSITY   (Taiwan)

Author keywords

Argon shielding; Bondability; Chips with copper interconnects; Reliability; Thermosonic wire bonding

Indexed keywords

ARGON; COPPER; GOLD; HIGH TEMPERATURE EFFECTS; MICROPROCESSOR CHIPS; OXIDATION; PACKAGING; RELIABILITY; WIRE;

ARGON SHIELDING; BONDABILITY; CHIPS WITH COPPER INTERCONNECTS; THERMOSONIC WIRE BONDING;

BONDING;

EID: 2342463685     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-004-0136-4     Document Type: Article

References (18)

1. J. Ida, M. Yoshimaru, T. Usami, A. Ohtomo, K. Shimokawa, A. Kita, and M. Ino, Proc. VLSI Technology Symp. (Tokyo: Business Center for Academic Societies Japan; Piscataway, NJ: IEEE, 1994), pp. 59-60.
2. M. Miyamoto, T. Takwda, and T. Furusawa, IEEE Trans. Electron Dev. 44, 250 (1997).
3. G. Deltoro and N. Sharif, 24th IEEE/CPMT (Piscataway, NJ: IEEE, 1999), pp. 185-188.
4. J. Onuki, M. Koizumi, and I. Araki, IEEE Trans. Comp. Hybrids, Manufacturing Technol. 12, 550 (1987).
5. G.G. Harman, Wire Bonding in Microelectronics (New York: McGraw-Hill, 1997), p. 29.
6. Y.R. Jeng, J.N. Aoh, and C.M. Wang, J. Phys. D: Appl. Phys. 34, 3515 (2001).
7. T.A. Tran, L. Yong, S. Chen, and A. Chen, IEEE Electronic Components and Technology Conf. (Piscataway, NJ: IEEE, 2000), pp. 1674-1680.
8. J.F. Rohan, G. O'Riordan, and J. Boardman, Appl. Surf. Sci. 185, 289 (2002).
9. J.G. Strandjord, S. Popelar, and C. Jauernig, Microelectron. Reliab. 42, 265 (2002).
10. EIA/JESD22-B116, Wire Bond Shear Test, EIA/JESD22-B116 (Arlington, VA: Electronic Industries Alliance, 1998).
11. MIL-STD-833E, Method No. 2011.7 - Bond Strength (Destructive Bond Pull Test), Test Methods Standards for Microcircuits (Phllippines; elmBE Research, 1997), semiconfareast.com.
12. S. Iwata, A. Ishizaka, and H. Yamamoto, Jpn. J. Inst. Met. 41, 1161 (1977).
13. P. Schealler, P. Groning, A. Schneuwly, P. Boschung, E. Muller, M. Blanc, and L. Sohlapbach, Ultrasonic 38, 212 (2000).
14. V. Koeninger, H.H. Uchida, and E. Fromm, IEEE Trans. Comp. Packaging Manufacturing Technol. Part A 18, 835 (1995).
15. E.M. Philofsky, Solid State Electron. 13, 1391 (1970).
16. H. Kato, Jpn. J. Phys. 25, 934 (1986).
17. W. Gerling, IEEE ECC (Piscataway, NJ: IEEE, 1984), pp. 13-20.
18. G.G. Harman, Wire Bonding in Microelectronics (New York: McGraw-Hill, 1997), p. 138.