Thermosonic Bonding of Gold Wire onto a Copper Pad with Titanium Thin-Film Deposition

Journal of Electronic Materials

Volumn 33, Issue 4, 2004, Pages 290-299

  Aoh, J N ^a   Chuang, Cheng Li ^a  

^a NATIONAL CHUNG CHENG UNIVERSITY   (Taiwan)

Author keywords

Bondability; Chips with copper interconnect; Thermosonic wire bonding; Ti thin film

Indexed keywords

AUGER ELECTRON SPECTROSCOPY; CHEMICAL ANALYSIS; COPPER; COPPER OXIDES; DEPOSITION; GOLD; HIGH TEMPERATURE EFFECTS; INTEGRATED CIRCUITS; MICROPROCESSOR CHIPS; OXIDATION; THIN FILMS; TITANIUM; WIRE;

BONDABILITY; CHIPS WITH COPPER INTERCONNECTS; THERMOSONIC WIRE BONDING; TI THIN FILMS;

BONDING;

EID: 2342489452     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-004-0135-5     Document Type: Article

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