The impact of copper contamination on the quality of the second wire bonding process using X-ray photoelectron spectroscopy method

Microelectronics Reliability

Volumn 42, Issue 3, 2002, Pages 375-380

  Lin, T Y ^a   Leong, W S ^a   Chua, K H ^a   Oh, R ^a   Miao, Y ^a   Pan, J S ^b   Chai, J W ^b  

^a Kolam Ayer Industrial Park   (Singapore)

^b INSTITUTE OF MATERIALS RESEARCH AND ENGINEERING   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; CONTAMINATION; COPPER; ELECTRONICS PACKAGING; PLATING; SURFACE PHENOMENA; WIRE; X RAY PHOTOELECTRON SPECTROSCOPY;

NON-STICK ON LEAD (NSOL); WIRE BONDING;

MICROELECTRONIC PROCESSING;

EID: 0036496549     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(02)00003-3     Document Type: Article

References (11)

1. Root cause analysis of non-stick on lead (NSOL) and verification of TQFP176 etched leadframe
2. An investigation on the plasma treatment of integrated circuit bond pads
3. Characterizing integrated circuit bond pads
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5. Bondability of silver plating on IC leadframe
6. Reliability Study of wire bonds to silver plating surfaces
7. +
8. AES and XPS analysis of angle of incidence effects of ion-beam-induced nitridation of GaAs
9. The evaluation of copper migration during the die attach curing and wire bonding process