An oxidation study of Cu leadframes

Proceedings - International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

Volumn , Issue , 1999, Pages 275-281

  Berriche, R ^a   Lowry, R ^a   Rosenfield, M I ^a  

^a INTERSIL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROLYTIC REDUCTION; INTERFACES (MATERIALS); MASS SPECTROMETRY; PACKAGING MATERIALS; SCANNING PROBE MICROSCOPY; SECONDARY ION MASS SPECTROMETRY; SURFACE ROUGHNESS;

ELECTROCHEMICAL REDUCTION ANALYSIS; LEAD FRAME; MICRO INDENTATION; OXIDE LAYER; SECONDARY ION MASS SPECTROSCOPIES (SIMS); VICKERS;

X RAY PHOTOELECTRON SPECTROSCOPY;

EID: 85037125917     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.1999.757326     Document Type: Conference Paper

References (7)

1. S. Kim, "The Role of Plastic Package Adhesion in IC Performance", IEEE 41st Electronic Components and Technology Conference, 750,1991.
2. H. Ohsuga, H. Suzuki, T. Aihara an T. Hamano, "Development of Molding Compounds Suited for Copper Leadframes", IEEE 44th Electronic Components and Technology Conference, 141,1994.
3. S.-J. Cho, K.-W. Paik and Y.-G. Kim, "The Effect of the Oxidation of Cu-Base Leadframe on the Interface Adhesion between Cu Metal and Epoxy Molding Compound", IEEE Transactions on Components, Packaging and Manufacturing Technology-Part B, 20(2) 167 1997.
4. C. T. Chong, A. Leslie, L. T. Beng and C. Lee, "Investigation on the Effect of Copper Leadframe Oxidation on Package Delamination", IEEE 45th Electronic Components and Technology Conference, 463,1995.
5. R. Berriche, S. Vahey and B. Gillett, "Effect of Oxidation on Mold Compound-Leadframe Adhesion", IMAPS, Braselton, GA, March 1999.
6. L. M. Moroney, R. C. Smart and M. W. Roberts, J. Chem. Soc. Faraday Trans., 1(79) 1769,1983.
7. E. Takano, T. Mino, K. Takahashi, K. Sawada, S-Y. Shimizu, H. Y. Yoo, "The Oxidation Control of Copper Leadframe Package for Prevention of Popcorn Cracking", IEEE 47th Electronic Components and Technology Conference, 78,1997.