Annealing textures of copper damascene interconnects for ultra-large-scale integration

Journal of Electronic Materials

Volumn 34, Issue 12, 2005, Pages 1493-1499

  Lee, Hyo Jong ^a   Han, Heung Nam ^a   Lee, Dong Nyung ^a  

^a Seoul National University   (South Korea)

Author keywords

Annealing; Copper interconnects; Nanostructures; Texture

Indexed keywords

ANNEALING; COMPUTER SIMULATION; GRAIN GROWTH; NANOSTRUCTURED MATERIALS; STRAIN; STRESS CONCENTRATION; TENSILE STRESS; TEXTURES;

COPPER INTERCONNECTS; ENERGY DENSITY; STRAIN ENERGY;

COPPER COMPOUNDS;

EID: 30344462391     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-005-0156-8     Document Type: Conference Paper

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