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Volumn 96, Issue 3, 2005, Pages 259-268

Current understanding of annealing texture evolution in thin films and interconnects

Author keywords

Annealing textures; Electrodeposits; Electroless deposits; Interconnects; Vapor deposits

Indexed keywords

CHEMICAL VAPOR DEPOSITION; ELECTRODEPOSITION; ELECTROLESS PLATING; GRAIN GROWTH; INTERFACIAL ENERGY; RECRYSTALLIZATION (METALLURGY); STRESSES; TEXTURES;

EID: 16244419760     PISSN: 00443093     EISSN: None     Source Type: Journal    
DOI: 10.3139/146.101029     Document Type: Article
Times cited : (19)

References (35)
  • 19
    • 16244410320 scopus 로고    scopus 로고
    • Mechanical properties of advanced engineering materials
    • October 27-31, Wuhan University of Technology, Wuhan, China, edited by B. Xu, M. Tokuda, G. Sun, Tsinghua University Press, Beijing
    • H. Park, D.N. Lee: Mechanical Properties of Advanced Engineering Materials (Proc. IMMM2003, October 27-31, 2003, Wuhan University of Technology, Wuhan, China), edited by B. Xu, M. Tokuda, G. Sun, Tsinghua University Press, Beijing, pp. 13-18.
    • (2003) Proc. IMMM2003 , pp. 13-18
    • Park, H.1    Lee, D.N.2
  • 20
    • 0003427458 scopus 로고    scopus 로고
    • Addison-Wesley Publ. Co., Inc.
    • nd Edition, Addison-Wesley Publ. Co., Inc., p. 102.
    • nd Edition , pp. 102
    • Cullity, B.D.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.