Circuit editing of copper and low-k dielectrics in nanotechnology devices

Journal of Microscopy

Volumn 214, Issue 3, 2004, Pages 246-251

  Mosselveld, F ^a   Makarov, V V ^a   Lundquist, T R ^a   Griffis, D P ^b   Russell, P E ^b  

^a NPTest   (United States)

^b NORTH CAROLINA STATE UNIVERSITY   (United States)

Author keywords

Copper etching; Device modification; Low k dielectrics

Indexed keywords

BIOLOGICAL MATERIALS; ETCHING; INTEGRATED CIRCUIT INTERCONNECTS; ION BEAMS; LOW-K DIELECTRIC; METALLIZING; TIMING CIRCUITS;

CARBON CONTENT; CARBONISATION; COPPER ETCHING; DEVICE MODIFICATION; INTEGRATED CIRCUIT DEVICES; LOW- K DIELECTRICS; METALLISATION; NANOSURGERY; NANOTECHNOLOGY DEVICES; ORGANIC MATERIALS;

COPPER;

CARBON; COPPER; METAL; ORGANIC COMPOUND;

CONFERENCE PAPER; DIELECTRIC CONSTANT; INTEGRATED CIRCUIT; MICROSURGERY; NANOTECHNOLOGY; POROSITY; PRIORITY JOURNAL; STRUCTURE ANALYSIS;

EID: 2942608903     PISSN: 00222720     EISSN: None     Source Type: Journal    
DOI: 10.1111/j.0022-2720.2004.01337.x     Document Type: Conference Paper

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