Channeling effects during focused-ion-beam micromachining of copper

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 18, Issue 4 I, 2000, Pages 1061-1065

  Phillips, J R ^a   Griffis, D P ^a   Russell, P E ^a  

^a NORTH CAROLINA STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; CRYSTAL ORIENTATION; GRANULAR MATERIALS; ION BOMBARDMENT; MICROMACHINING; SINGLE CRYSTALS; TEXTURES; THIN FILMS; VAPOR DEPOSITION;

CHANNELLING EFFECT; FOCUSED-ION-BEAM MICROMACHINING (FIBM); PHYSICAL VAPOR DEPOSITION (PVD);

METALLIC FILMS;

EID: 0034227730     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.582300     Document Type: Article

References (15)

1. K. D. Beyer et al., U.S. Patent No. 4,944,836 (1990).
2. C. Kaanta, W. Cote, J. Cronin, K. Holland, P. I. Lee, and T. Wright, Tech. Dig. Int. Electron Devices Meet. 209 (1987).
3. T. J. Licata, E. G. Colgan, J. M. E. Harper, and S. E. Luce, IBM J. Res. Dev. 39, 419 (1995).
4. J. Melngailis, J. Vac. Sci. Technol. B 5, 469 (1987).
5. R. J. Young, Vacuum 44, 353 (1993).
6. P. D. Prewett, Vacuum 44, 345 (1993).
7. D. Santamore, K. Edinger, J. Orloff, and J. Melngailis, J. Vac. Sci. Technol. B 15, 2346 (1997).
8. Sputtering by Particle Bombardment I, edited by R. Behrisch (Springer, Berlin, 1981).
9. J. Ferron, E. V. Alonso, R. S. Baragiola, and A. Oliva-Florio, Phys. Rev. B 24, 4412 (1981).
10. H. Yamaguchi, A. Shimase, S. Haraichi, and T. Miyauchi, J. Vac. Sci. Tecnnol. B 3, 71 (1985).
11. L. C. Feldman, J. W. Mayer, and S. T. Picraux, Materials Analysis by Ion Channeling (Academic, New York, 1982).
12. R. Levi-Setti, T. R. Fox, and K. Lam, Nucl. Instrum. Methods Phys. Res. 205, 299 (1983).
13. J. Gupta, J. M. E. Harper, J. L. Mauer IV, P. G. Blauner, and D. A. Smith, Appl. Phys. Lett. 61, 663 (1992).
14. I. V. Tomov, D. S. Stoychev, and I. B. Vitanova, J. Appl. Electrochem. 15, 887 (1985).
15. C. Lingk, M. E. Gross, and W. L. Brown, Appl. Phys. Lett. 74, 682 (1999).