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Volumn 41, Issue 9-10, 2001, Pages 1631-1635

Reliability studies on multilevel interconnection with intermetal dielectric air gaps

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM ALLOYS; ASPECT RATIO; COMPUTER SIMULATION; DIELECTRIC MATERIALS; ELASTIC MODULI; ELECTROMIGRATION; FAILURE ANALYSIS; PASSIVATION; RELIABILITY;

EID: 0035457052     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(01)00153-6     Document Type: Article
Times cited : (7)

References (8)
  • 5
    • 0006985240 scopus 로고    scopus 로고
    • Stanford University
    • SPEEDIE 3.5 Manual, Stanford University, 1999.
    • (1999) SPEEDIE 3.5 Manual
  • 6
    • 33847603447 scopus 로고    scopus 로고
    • CED Research Corp., Huntsville, AL 35805
    • CED Research Corp., Huntsville, AL 35805.
  • 7
    • 0038035318 scopus 로고
    • Stress evolution due to electromigration in confined metal lines
    • Korhonen MA, Borgesen P, Tu KN, and Li C-Y. Stress evolution due to electromigration in confined metal lines. J. Appl. Phys. 73 (1993) 3790-3799.
    • (1993) J. Appl. Phys. , vol.73 , pp. 3790-3799
    • Korhonen, M.A.1    Borgesen, P.2    Tu, K.N.3    Li, C.-Y.4
  • 8
    • 0000160317 scopus 로고    scopus 로고
    • Simulations of stress evolution and current density scaling of electromigration-induced failure times in pure and alloyed interconnects
    • Park YJ, Andleigh VK and Thompson CV. Simulations of stress evolution and current density scaling of electromigration-induced failure times in pure and alloyed interconnects. J. Appl.Phys. 85 (1999) 3546-3555.
    • (1999) J. Appl.Phys. , vol.85 , pp. 3546-3555
    • Park, Y.J.1    Andleigh, V.K.2    Thompson, C.V.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.