Device dependent control of chemical-mechanical polishing of dielectric films

IEEE Transactions on Semiconductor Manufacturing

Volumn 13, Issue 3, 2000, Pages 331-343

  Patel, Nital S ^a,b   Miller, Gregory A ^b   Guinn, Christopher ^b   Cruz Sanchez, Adriana ^b   Jenkins, Steven T ^b  

^a IEEE

^b TEXAS INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; CHEMICAL POLISHING; COMPUTER SIMULATION; DIELECTRIC FILMS; INTEGRATED CIRCUIT LAYOUT; PROCESS CONTROL; PRODUCTION CONTROL; SILICON WAFERS;

CHEMICAL MECHANICAL POLISHING; INTERLEVEL DIELECTRIC FILMS; PREMETAL DIELECTRIC FILMS; RUN TO RUN CONTROL;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0034249185     PISSN: 08946507     EISSN: None     Source Type: Journal    
DOI: 10.1109/66.857944     Document Type: Article

References (15)

1. I. Ali, S. Roy, and G. Shinn, "Chemical-mechanical polishing of interlayer dielectric: A review," Solid State Technol., vol. 37, no. 10, pp. 63-70, 1994.
2. D. Boning, W. Moyne, T. Smith, J. Moyne, R. Telfeyan, A. Hurwitz, S. Shellman, and J. Taylor, "Run by run control of chemical-mechanical polishing," in Proc. 17th IEEE/CPMT Int. Electron. Manuf. Technol. Symp., Austin, TX, 1995, pp. 81-87.
3. R. Telfeyan, J. Moyne, N. Chaudhry, J. Pugmire, S. Shellman, D. Boning, W. Moyne, A. Hurwitz, and J. Taylor, "A multi-level approach to the control of a chemical-mechanical planarization process," J. Vac. Sci. Technol. A, vol. 14, no. 3, pp. 1907-1913, 1996.
4. W. Campbell and A. Pasadyn, "Run-to-run control of within-wafer uniformity in oxide chemical mechanical planarization," in Proc. AEC/APC Symp. XI, vol. II, Vail, CO, 1999, pp. 673-679.
5. A. Toprac, W. Campbell, and C. May, "APC framework run-to-run control applications in Fab 25," in AEC/APC Symp. X, vol. II, Vail, CO, 1998, pp. 479-486.
6. W. Campbell, "Model predictive run-to-run control of chemical mechanical planarization," Ph.D. dissertation, Univ. Texas, Austin, 1999.
7. M. Miller, W. Campbell, and T. Edgar, "Run-to-run control of multi-product processes," presented at the AIChE Annu. Meet., Miami Beach, FL, 1998.
8. T. Smith, S. Fang, J. Stefani, G. Shinn, D. Boning, and S. Butler, "Device independent process control of chemical-mechanical polishing," in Meeting Abstracts, 195th Society Meeting. Seattle, WA: Electrochemical Society, Inc., 1999.
9. D. Ouma, D. Boning, J. Chung, G. Shinn, L. Olsen, and J. Clark, "An integrated characterization and modeling methodology for CMP dielectric planarization," in Proc. Int. Interconnect Technol. Conf., San Francisco, CA, 1998, pp. 67-69.
10. B. Stine, D. Ouma, R. Divecha, D. Boning, J. Chung, D. Hetherington, C. Harwood, O. Nakagawa, and S.-Y. Oh, "Rapid characterization and modeling of pattern-dependent variations in chemical-mechanical polishing," IEEE Trans. Semiconduct. Manufac., vol. 11, pp. 129-140, 1998.
11. J. Moyne, C. Chemali, J. Colt, J. C. Sokol, and T. Parikh, "Yield improvement at contact through run-to-run control," in Proc. AEC/APC Symp. XI, vol. II, Vail, CO, 1999, pp. 681-697.
12. J. Grillaert, M. Meuris, N. Heyley, K. Devriendt, and M. Heyns, "Modeling step height reduction and local removal rates based on pad-substrate interactions," in Proc. CMP-MIC, 1998, pp. 79-86.
13. O. J. M. Smith, Feedback Control Systems. New York: McGraw-Hill, 1958.
14. B. C. Kuo, Automatic Control Systems, 7th ed. Englewood Cliffs, NJ: Prentice-Hall, 1995.
15. R. Maakestad, M. Stebenne, and D. German, "Deployment of APC for semiconductor manufacturing improvement at Texas Instruments," in AEC/APC Symp. XI, vol. II, Vail, CO, 1999, pp. 483-490.