Film transfer and bonding techniques for covering single-chip ejector array with microchannels and reservoirs

Journal of Microelectromechanical Systems

Volumn 14, Issue 6, 2005, Pages 1399-1408

  Kwon, Jae Wan ^a,b   Yu, Hongyu ^a   Kim, Eun Sok ^a  

^a University of Southern California ^*  (United States)

^b University of Missouri   (United States)

Author keywords

Acoustic droplet ejector; Enclosed microchannels and reservoirs; Epoxy wicking; Film cover; Integrated ejector array; Microfluidic systems; Parylene bonding

Indexed keywords

ATMOSPHERIC PRESSURE; BOND STRENGTH (MATERIALS); BONDING; CURING; FABRICATION; FLUIDIC DEVICES; SCANNING ELECTRON MICROSCOPY; SILICON; SPIN COATING; THIN FILMS;

ACOUSTIC DROPLET EJECTOR; ENCLOSED MICROCHANNELS; ENCLOSED RESERVOIRS; EPOXY WICKING; FILM COVER; INTEGRATED EJECTOR ARRAY; MICROFLUIDIC SYSTEMS; PARYLENE BONDING;

MICROELECTROMECHANICAL DEVICES;

EID: 29244446248     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2005.859090     Document Type: Article

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