Simultaneous buffer insertion and wire sizing considering systematic CMP variation and random leff variation

Proceedings of the International Symposium on Physical Design

Volumn , Issue , 2005, Pages 78-85

  He, Lei ^a   Kahng, Andrew ^b,c   Tam, King Ho ^a   Xiong, Jinjun ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b UNIVERSITY OF CALIFORNIA   (United States)

^c Blaze DfM   (United States)

Author keywords

Buffering; Chemical Mechanical Polishing (CMP); Design for Manufacturing; Wire Sizing; Yield

Indexed keywords

CHEMICAL MECHANICAL POLISHING; ELECTRIC POWER SYSTEM INTERCONNECTION; MATHEMATICAL MODELS; OPTIMIZATION; PROBABILITY DENSITY FUNCTION;

BUFFERING; DESIGN FOR MANUFACTURING; WIRE SIZING; YIELD;

ELECTRIC WIRE;

EID: 29144516335     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1145/1055137.1055154     Document Type: Conference Paper

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