Vapor pressure and residual stress effects on mixed mode toughness of an adhesive film

International Journal of Fracture

Volumn 134, Issue 3-4, 2005, Pages 349-368

  Chew, H B ^a   Guo, T F ^a   Cheng, L ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

Adhesive; Damage; Fracture toughness; Polymers; Porous material; Void growth

Indexed keywords

CRACK PROPAGATION; DELAMINATION; FRACTURE TOUGHNESS; MATHEMATICAL MODELS; POLYMERS; POROUS MATERIALS; RESIDUAL STRESSES; VAPOR PRESSURE;

PLASTIC ENCAPSULATED MICROCIRCUITS (PEMS); POLYMERIC ADHESIVE; VOID GROWTH;

ADHESIVES;

EID: 27844566292     PISSN: 03769429     EISSN: 15732673     Source Type: Journal    
DOI: 10.1007/s10704-005-2427-z     Document Type: Article

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