Vapor pressure and void size effects on failure of a constrained ductile film

Journal of the Mechanics and Physics of Solids

Volumn 51, Issue 6, 2003, Pages 993-1014

  Guo, T F ^a   Cheng, L ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

A. Adhesion and adhesives; B. Polymers; Fracture mechanisms; Porous material; Voids and inclusions

Indexed keywords

ADHESIVES; CRACK PROPAGATION; FAILURE ANALYSIS; FRACTURE; PLASTIC FLOW; POROUS MATERIALS; THERMAL STRESS; VAPOR PRESSURE;

VOIDS;

PLASTIC FILMS;

EID: 0037409454     PISSN: 00225096     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0022-5096(03)00007-3     Document Type: Article

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