Vapor pressure assisted crack growth at interfaces under mixed mode loading

Computational Materials Science

Volumn 30, Issue 3-4 SPEC. ISS., 2004, Pages 425-432

  Chong, C W ^a   Guo, T F ^a   Cheng, L ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

Cell model; Finite element analysis; Interface toughness; Popcorn failure; Void growth

Indexed keywords

DUCTILITY; ELECTRONICS PACKAGING; EPOXY RESINS; FINITE ELEMENT METHOD; GLASS TRANSITION; INTEGRATED CIRCUITS; POROUS MATERIALS; PROTECTIVE COATINGS; THERMAL STRESS;

CELL MODEL; INTERFACE TOUGHNESS; POPCORN FAILURE; VOID GROWTH;

FRACTURE TOUGHNESS;

EID: 3142750608     PISSN: 09270256     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.commatsci.2004.02.036     Document Type: Conference Paper

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