Vapor pressure and residual stress effects on failure of an adhesive film

International Journal of Solids and Structures

Volumn 42, Issue 16-17, 2005, Pages 4795-4810

  Chew, H B ^a   Guo, T F ^a   Cheng, L ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

Adhesive; Damage; Fracture mechanisms; Polymers; Porous material; Void growth

Indexed keywords

INTERFACES (MATERIALS); NETWORKS (CIRCUITS); POLYMERS; POROSITY; SUBSTRATES; VAPOR PRESSURE;

CENTERLINE CRACK; FRACTURE MECHANISM; POROUS MATERIAL; VOID GROWTH;

RESIDUAL STRESSES;

EID: 18144425503     PISSN: 00207683     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijsolstr.2005.01.012     Document Type: Article

References (33)

1. P. Alpern, R. Dudek, R. Schmidt, V. Wicher, and R. Tilgner On the mode II popcorn effect in thin packages IEEE Transactions on Components and Packaging Technologies 25 1 2002 56 65
2. L. Cheng, and T.F. Guo Vapor pressure assisted void growth and cracking of polymeric films and interfaces Interface Science 11 2003 277 290
3. H.B. Chew, T.F. Guo, and L. Cheng Vapor pressure and residual stress effects on the toughness of polymeric adhesive joints Engineering Fracture Mechanics 71 2004 2435 2448
4. C.W. Chong, T.F. Guo, and L. Cheng Vapor pressure assisted crack growth at interfaces under mixed mode loading Computational Materials Science 30 2004 425 432
5. R.S. Chowdhury, and R. Narasimhan Finite element simulations of ductile rupture in a constrained metal foil Material Science and Engineering A 191 1995 27 37
6. R.S. Chowdhury, and R. Narasimhan A finite element analysis of stationary crack tip fields in a pressure sensitive constrained ductile layer International Journal of Solids and Structures 37 2000 3079 3100
7. R.S. Chowdhury, and R. Narasimhan A finite element analysis of quasistatic crack growth in a pressure sensitive constrained ductile layer Engineering Fracture Mechanics 66 2000 551 571
8. P. Dong, and J. Pan Elastic-plastic analysis of cracks in pressure sensitive materials International Journal of Solids and Structures 28 1991 1113 1127
9. A.G. Evans, and J.W. Hutchinson The thermomechanical integrity of thin films and multilayers Acta Metallurgica et Materialia 43 7 1995 2507 2530
10. J. Faleskog, X. Gao, and C.F. Shih Cell model for non-linear fracture analysis-I. Micromechanics calibration International Journal of Fracture 89 1998 355 373
11. Fukuzawa, I., Ishiguro, S., Nanbu, S., 1985. Moisture resistance degradation of plastic LSIs by reflow soldering. In: IEEE/IRPS International Reliability of Physics Symposium, pp. 192-197
12. J.E. Galloway, and B.M. Miles Moisture absorption and desorption predictions for plastic ball grid array packages IEEE Transactions on Components Packaging and Manufacturing Technology Part A 20 3 1997 274 279
13. L.J. Gibson, and M.F. Ashby Cellular solids: structure and properties second ed. 1997 Cambridge University Press Cambridge, UK
14. Gullerud, A.S., Koppenhoefer, K.C., Ruggieri, C., Dodds, Jr. R.H., 2002. WARP3D: 3-D dynamic nonlinear fracture analysis of solids using parallel computers and workstations. Civil Engineering Studies, Structural Research Series No. 607, UILU-ENG-95-2012, University of Illinois at Urbrana-Champaign
15. T.F. Guo, and L. Cheng Thermal and vapor pressure effects on cavitation and void growth Journal of Materials Science 36 24 2001 5871 5879
16. T.F. Guo, and L. Cheng Modeling vapor pressure effects on void rupture and crack growth resistance Acta Materialia 50 13 2002 3487 3500
17. T.F. Guo, and L. Cheng Vapor pressure and void size effects on failure of a constrained ductile film Journal of the Mechanics and Physics of Solids 51 2003 993 1014
18. A.L. Gurson Continuum theory of ductile rupture by void nucleation and growth: Part I-Yield criteria and flow rules for porous ductile media Journal of Engineering Materials and Technology 99 1977 2 15
19. Y. Huang, K.X. Hu, C.P. Yeh, N.Y. Li, and K.C. Hwang A model study of thermal stress-induced voiding in electronic packages Journal of Electronic Packaging 118 1996 229 234
20. F.Z. Li, and J. Pan Plane-strain crack-tip fields for pressure-sensitive dilatant materials Journal of Applied Mechanics 57 1990 40 49
21. F.Z. Li, and J. Pan Plane-stress crack-tip fields for pressure-sensitive dilatant materials Engineering Fracture Mechanics 35 1990 1105 1116
22. S. Liu, and Y. Mei Behavior of delaminated plastic IC packages subjected to encapsulation cooling, moisture absorption, and wave soldering IEEE Transactions on Components Packaging and Manufacturing Technology Part A 18 3 1995 634 645
23. B. Moran, and C.F. Shih A general treatment of crack tip contour integrals International Journal of Fracture 35 1987 363 371
24. S. Omi, K. Fujita, T. Tsuda, and T. Maeda Causes of cracks in SMD and type-specific remedies IEEE Transactions on Components Packaging and Manufacturing Technology 14 4 1991 818 823
25. H.L.J. Pang, and C.W. Seetoh A compact mixed mode (CMM) fracture specimen for adhesive bonded joints Engineering Fracture Mechanics 57 1997 57 65
26. H.L.J. Pang, X. Zhang, X. Shi, and Z.P. Wang Interfacial fracture toughness test methodology for adhesive bonded joints IEEE Transactions on Components and Packaging Technologies 25 2 2002 187 191
27. A.C. Steenbrink, E. Van der Giessen, and P.D. Wu Void growth in glassy polymers Journal of the Mechanics and Physics of Solids 45 1997 405 437
28. A.A.O. Tay, and T.Y. Lin Influence of temperature, humidity, and defect location on delamination in plastic IC packages IEEE Transactions on Components and Packaging Technologies 22 4 1999 512 518
29. A. Trigg Applications of infrared microscopy to IC and MEMs packaging IEEE Transactions on Electronics Packaging Manufacturing 26 3 2003 232 238
30. V. Tvergaard Material failure by void growth to coalescence Advances in Applied Mechanics 27 1990 83 151
31. V. Tvergaard, and J.W. Hutchinson On the toughness of ductile adhesive joints Journal of the Mechanics and Physics of Solids 44 5 1996 789 800
32. A.G. Varias, Z. Suo, and C.F. Shih Ductile failure of a constrained metal foil Journal of the Mechanics and Physics of Solids 39 7 1991 963 986
33. L. Xia, and C.F. Shih Ductile crack growth-I. A numerical study using computational cells with microstructurally based length scales Journal of the Mechanics and Physics of Solids 43 2 1995 233 259