Applications of infrared microscopy to IC and MEMS packaging

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 26, Issue 3, 2003, Pages 232-238

  Trigg, Alastair ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

Die bonding; IR radiation; MEMS; Silicon; Wire bonding

Indexed keywords

BONDING; CORROSION; DEFECTS; DELAMINATION; ENERGY GAP; FLIP CHIP DEVICES; INTEGRATED CIRCUIT MANUFACTURE; MICROELECTROMECHANICAL DEVICES; MICROSCOPIC EXAMINATION; OPTICAL RESOLVING POWER; SEMICONDUCTING SILICON; TRANSPARENCY;

DELAMINATION CRACKS; DIE BONDING; INFRARED MICROSCOPY; WIRE BONDING; ZERO CHROMATIC ABERRATION;

INFRARED SPECTROSCOPY;

EID: 0742286375     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2003.820807     Document Type: Article

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