Thermal and vapor pressure effects on cavitation and void growth

Journal of Materials Science

Volumn 36, Issue 24, 2001, Pages 5871-5876

  Guo, T F ^a   Cheng, L ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

CAVITATION; COALESCENCE; CRACK PROPAGATION; INTERFACES (MATERIALS); MATHEMATICAL MODELS; SOLDERING; STRAIN; THERMAL STRESS; VAPOR PRESSURE; VOLUME FRACTION;

POPCORN CRACKING;

ELECTRONICS PACKAGING;

EID: 0035893384     PISSN: 00222461     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1012924626044     Document Type: Article

References (22)