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Acta Materialia

Volumn 50, Issue 13, 2002, Pages 3487-3500

Modeling vapor pressure effects on void rupture and crack growth resistance

(2) Guo, T F a Cheng, L a

a NATIONAL UNIVERSITY OF SINGAPORE (Singapore)

Author keywords

Finite element analysis; Polymers; Porous material; Toughness; Void growth

Indexed keywords

ABSORPTION; CONDENSATION; CRACK PROPAGATION; DIES; FINITE ELEMENT METHOD; FRACTURE TOUGHNESS; INTERFACES (MATERIALS); MASKS; MOISTURE; POROSITY; SOLDERING; SUBSTRATES; THERMAL STRESS; VAPOR PRESSURE; VAPORIZATION;

CRACK GROWTH RESISTANCE;

ELECTRONICS PACKAGING;

EID: 0036681578 PISSN: 13596454 EISSN: None Source Type: Journal
DOI: 10.1016/S1359-6454(02)00162-3 Document Type: Article

Times cited : (57)

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