Vapor pressure assisted void growth and cracking of polymeric films and interfaces

Interface Science

Volumn 11, Issue 3, 2003, Pages 277-290

  Cheng, L ^a   Guo, T F ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

Adhesion and adhesives; Fracture mechanisms; Layered material; Polymers; Porous material; Void growth

Indexed keywords

CRACK INITIATION; FILLERS; FILM GROWTH; INTEGRATED CIRCUIT MANUFACTURE; MOISTURE; PLASTIC FILMS; POLYMERS; POROSITY; PRESSURE EFFECTS; SEMICONDUCTING SILICON; SHEET MOLDING COMPOUNDS; VAPOR PRESSURE;

FILLER PARTICLE POLYMER MATRIX INTERFACES; POLYMERIC FILMS; VAPOR PRESSURE ASSISTED VOID GROWTH;

INTERFACES (MATERIALS);

EID: 0141854001     PISSN: 09277056     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1025140121815     Document Type: Article

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