Interface delamination in plastic IC packages induced by thermal loading and vapor pressure - A micromechanics model

IEEE Transactions on Advanced Packaging

Volumn 26, Issue 1, 2003, Pages 1-9

  Liu, P ^a   Cheng, L ^a   Zhang, Y W ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

Cohesive law; Finite element method; Interface delamination; Mode mixity; Plastic IC packages; Thermal loading; Vapor pressure

Indexed keywords

BOND STRENGTH (MATERIALS); DELAMINATION; FINITE ELEMENT METHOD; INTERFACES (MATERIALS); INTERFACIAL ENERGY; MATHEMATICAL MODELS; MOISTURE; PLASTIC PRODUCTS; SHEET MOLDING COMPOUNDS; THERMAL EFFECTS; THERMAL LOAD; VAPOR PRESSURE;

ADHESION STRENGTH; COHESIVE LAW; INTERFACE DELAMINATION; MICROMECHANICS MODEL; MODE MIXITY; PLASTIC INTEGRATED CIRCUIT PACKAGES;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0037942582     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2003.811370     Document Type: Article

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