Experimental and theoretical investigations of delamination at free edge of interface between piezoelectric thin films on a substrate

International Journal of Solids and Structures

Volumn 42, Issue 5-6, 2005, Pages 1729-1741

  Shang, F ^a   Kitamura, T ^a   Hirakata, H ^a   Kanno, I ^a   Kotera, H ^a   Terada, K ^a  

^a KYOTO UNIVERSITY   (Japan)

Author keywords

Delamination; Interface strength; Piezoelectric material; Thin film

Indexed keywords

CRACK INITIATION; DELAMINATION; INTERFACES (MATERIALS); MAGNETRON SPUTTERING; MICROELECTROMECHANICAL DEVICES; PIEZOELECTRIC MATERIALS; PLASTIC DEFORMATION; RANDOM ACCESS STORAGE; SANDWICH STRUCTURES; SINGLE CRYSTALS; STRESS CONCENTRATION; STRESS INTENSITY FACTORS; TENSILE STRESS; TOUGHNESS; X RAY DIFFRACTION ANALYSIS;

DELAMINATION TESTS; INTERFACE STRENGTH; INTERFACE TOUGHNESS; PIEZOELECTRIC THIN FILMS;

THIN FILMS;

EID: 9944251825     PISSN: 00207683     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijsolstr.2004.08.004     Document Type: Article

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