Pore sealing of a porous dielectric by using a thin PECVD a-SiC:H conformal liner

Journal of the Electrochemical Society

Volumn 152, Issue 10, 2005, Pages

  Jousseaume, V ^a,c   Fayolle, M ^a   Guedj, C ^a   Haumesser, P H ^a   Huguet, C ^b   Pierre, F ^a   Pantel, R ^b   Feldis, H ^b   Passemard, G ^b  

^a CEA LETI   (France)

^b STMICROELECTRONICS   (France)

^c ELECTROCHEMICAL SOCIETY   (France)

Author keywords

[No Author keywords available]

Indexed keywords

CONFORMAL LINERS; DAMASCENE STRUCTURES; PORE SEALING; POROUS DIELECTRICS;

AMORPHOUS SILICON; COPPER; DIELECTRIC MATERIALS; DIFFUSION; ELECTRON ENERGY LOSS SPECTROSCOPY; METALLIZING; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; RUTHERFORD BACKSCATTERING SPECTROSCOPY; SEALING (CLOSING); SILICON CARBIDE;

POROUS MATERIALS;

EID: 27644553869     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2018607     Document Type: Article

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