Enhancement of underfill adhesion to die and substrate by use of silane additives

Proceedings - 4th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces

Volumn 1998-March, Issue , 1998, Pages 49-52

  Vincent, M B ^a   Meyers, Laura ^a   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ALUMINA; ALUMINUM OXIDE; COUPLING AGENTS; DIES; FLIP CHIP DEVICES; INTERFACES (MATERIALS); PACKAGING MATERIALS; RELIABILITY; THERMAL EXPANSION; MATERIALS TESTING; PLASTICS FILLERS; SHEAR STRENGTH; SILANES; SUBSTRATES; SURFACES;

ENCAPSULANTS; FLIP CHIP ASSEMBLIES; FLIP CHIP TECHNOLOGIES; MECHANICAL PROTECTION; SILANE COUPLING AGENT; SOLDER MASK; SUBSTRATE SURFACE; THERMOMECHANICAL RELIABILITY;

CHIP SCALE PACKAGES; ELECTRONICS PACKAGING;

ADHESION TESTING; THERMOMECHANICAL RELIABILITY; UNDERFILL ENCAPSULANT;

EID: 0032230782     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.1998.664432     Document Type: Conference Paper

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