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Volumn 202, Issue 4, 2005, Pages 509-515

III-V layer transfer onto silicon and applications

Author keywords

[No Author keywords available]

Indexed keywords

BONDING TECHNOLOGIES; INTEGRATION DENSITY; MICROELECTRONICS MANUFACTURING; THREADING DISLOCATIONS;

EID: 25444463014     PISSN: 18626300     EISSN: 18626319     Source Type: Journal    
DOI: 10.1002/pssa.200460411     Document Type: Conference Paper
Times cited : (23)

References (16)
  • 8
    • 1342315861 scopus 로고    scopus 로고
    • Strained silicon on insulator wafers
    • Santa Fe, NM, USA
    • B. Ghyselen et al., Strained Silicon On insulator wafers, in: Proceedings ICSI3 (Santa Fe, NM, USA, 2003).
    • (2003) Proceedings ICSI3
    • Ghyselen, B.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.