Thermal effects during focused electron beam induced deposition of nanocomposite magnetic-cobalt-containing tips

Microelectronic Engineering

Volumn 73-74, Issue , 2004, Pages 553-558

  Utke, I ^a   Bret, T ^a   Laub, D ^a   Buffat, Ph ^a   Scandella, L ^b   Hoffmann, P ^a  

^a EPFL   (Switzerland)

^b Nanosurf AG   (Switzerland)

Author keywords

Cobalt carbonyl; Focused electron beam induced deposition; Heat dissipation; Magnetic nano composite; Thermal decomposition

Indexed keywords

ATOMIC FORCE MICROSCOPY; CHEMICAL VAPOR DEPOSITION; COBALT COMPOUNDS; ENERGY DISPERSIVE SPECTROSCOPY; HEAT LOSSES; NANOSTRUCTURED MATERIALS; POLYCRYSTALLINE MATERIALS; SCANNING ELECTRON MICROSCOPY; STOICHIOMETRY; THERMAL EFFECTS; TRANSMISSION ELECTRON MICROSCOPY;

COBALT CARBONYL; FOCUSED ELECTRON BEAM INDUCED DEPOSITION; MAGNETIC NANO-COMPOSITE; THERMAL DEPOSITION;

MICROELECTRONICS;

EID: 2542499189     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(04)00138-8     Document Type: Conference Paper

References (19)

1. Edinger K., Gotszalk T., Rangelow I.W. J. Vac. Sci. Technol. B. 19:2001;2856-2860.
2. Bøggild P., Hansen T.M., Tanasa C., Grey F. Nanotechnology. 12:2001;331-335.
3. Koops H.W.P., Schossler C., Kaya A., Weber M. J. Vac. Sci. Technol. B. 14:1996;4105-4109.
4. Takai M., Kishimoto T., Morimoto H., Park Y.K., Lipp S., Lehrer C., Frey L., Ryssel H., Hosono A., Kawabuchi S. Microelectron. Eng. 41-42:1998;453-456.
5. Akama Y., Nishimura E., Sakai A., Murakami H. J. Vac. Sci. Technol. A. 8:1990;429-433.
6. Hubner B., Koops H.W.P., Pagnia H., Sotnik N., Urban J., Weber M. Ultramicroscopy. 42:1992;1519-1525.
7. Sqalli O., Utke I., Hoffmann P., Marquis-Weible F. J. Appl. Phys. 92:2002;1078-1083.
8. Castagne M., Benfedda M., Lahimer S., Falgayrettes P., Fillard J.P. Ultramicroscopy. 76:1999;187-194.
9. Utke I., Berger R., Scandella L., Hoffmann P. Appl. Phys. Lett. 80:2002;4792-4794.
10. Rothschild M., Sedlacek J.H.C., Shaver D.C., Ehrlich D.J., Bittenson S.N., Edwards D., Economou N.P. Mat. Res. Soc. Symp. Proc. 158:1990;79-84.
11. Lau Y.M., Chee P.C., Thong J.T.L., Ng V. J. Vac. Sci. Technol. A. 20:2002;1295-1302.
12. Weber M., Koops H.W.P., Rudolph M., Kretz J., Schmidt G. J. Vac. Sci. Technol. B. 13:1995;1364-1368.
13. Utke I., Cicoira F., Jaenchen G., Hoffmann P., Scandella L., Dwir B., Kapon E., Laub D., Buffat P.A., Xanthopoulos N., Mathieu H.J. Mat. Res. Soc. Symp. Proc. 706:2002;307-312.
14. Utke I., Luisier A., Hoffmann P., Buffat P.A., Laub D. Appl. Phys. Lett. 81:2002;3245-3247.
15. Reimer L. Scanning Electron Microscopy. second ed. 1998;Springer, Berlin.
16. Bret T., Utke I., Bachmann A., Hoffmann P. Appl. Phys. Lett. 83:2003;4005-4007.
17. Scheuer V., Koops H., Tschudi T. Microelectron. Eng. 5:1986;423-430.
18. Rhee H.S., Ahn B.T. J. Electrochem. Soc. 146:1999;2720-2724.
19. Kunz R.R., Mayer T.M. J. Vac. Sci. Technol. B. 6:1988;1557-1564.