Experimental damage mechanics of microelectronic solder joints under fatigue loading

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2005, Pages 874-881

  Basaran, C ^a   Tang, H ^b   Nie, S ^a  

^a State University of New York   (United States)

^b RENESAS TECHNOLOGY CORP   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BALL GRID ARRAY (BGA); FATIGUE LOADING; MECHANICAL CYCLING;

DEGRADATION; ELECTRONICS PACKAGING; FATIGUE OF MATERIALS; INTERFEROMETRY; MICROELECTRONICS; STRAIN;

SOLDERED JOINTS;

EID: 24644482018     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (54)

1. Adams, P. J., 1986, "Thermal Fatigue of Solder Joints in Micro-Electronic Devices", M.S. Thesis, Department of Mechanical Engineering, MIT, Cambridge, MA.
2. Armstrong, P. J. and Frederick, C. O., 1966, " A Mathematical Representation of the Multiracial Bauschinger Effect", G.E.G.B. Report RD/B/N731
3. Basaran, C. and Wen, Y, "Grain Growth in Eutectic Pb/Sn Ball Grid Array Solder Joints", ITherm 2002 Conference.
4. Basaran, C. and Jiang, J., "Measuring Intrinsic Elastic Modulus for Pb/Sn Solder Alloys," Mechanics of Materials, (to appear).
5. Basaran, C. and Tang, H., 2002, "Implementation of a thermodynamic framework for damage mechanics of solder interconnects in microelectronics packaging", International Journal of Damage Mechanics, v 11 n, p. 87-108.
6. Basaran, C., and Tang, H. et al, 2001, "Computer simulation of Solder joint reliability tests," Advanced Packaging, Vol. 1, 17-22.
7. Basaran, C., Chandaroy, R., 1998, "Mechanics of Pb40/Sn60 Near-eutectic Solder Alloys Subjected to Vibration", Applied Mathematical Modeling, Vol.22, pp601-627
8. Basaran, C., Dishongh, T. and Zhao, Y., 2001, "Selecting a Temperature Time History for Predicting Fatigue Life of Microelectronic Solder Joints," Journal of Thermal Stresses, Vol. 24, No. 11, pp 1069-1085.
9. Basaran, C., Yan, C., 1998, "A Thermodynamic Framework for Damage Mechanics of Solder Joints", Journal of Electronic Packaging, Trans. ASME, Vol.120, pp. 379-384.
10. Bazant, Z. P., 1991, "Why Continuum Damage is Nonlocal: Micromechanics Arguments", Journal Engineering Mechanics, ASCE, Vol. 117, No. 5, pp. 1070-1087.
11. Begley, M. and Hutchinson, J., 1998, "The Mechanics of Size Dependent Indentation", J. Mech. Phys. Solids, Vol. 46, No. 10, pp 2049-2068.
12. Bonda, N.R. and Noyan. I. C., 1996, "Effect of the Specimen Size in Predicting the Mechanical Properties of PbSn Solder Alloys," Trans. Comp. Pack, and Manuf. Tech., A., 19(2).
13. Busso, E. P., Kitano, M., Kamazawa, 1992, "A Visco-Plastic Constitutive Model for 60/40 Tin-Lead Solder Used in IC Package Joints", Journal of Engineering Materials and Technology, Vol. 114, pp. 331-337
14. Chaboche, J. L., 1989, "Constitutive Equations for Cyclic Plasticity and Viscoplasticity", International Journal of Plasticity, Vol. 5, pp. 247-302
15. Chaboche, J.L., and Lesne, P.M., 1988, "A Non-Linear Continuous Fatigue Damage Model", Fatigue Fracture Engineering Mater, and Struct., 11, 1-17
16. Chow, C. L., Chen, X. F., 1992, "An Anisotropic Model of Damage Mechanics Based on Endochronic Theory of Plasticity", Int. Journal of Fracture, Vol. 55, pp. 115-130.
17. Chow, C.L., Yang, F., 1998, "Damage Mechanics Characterization on Fatigue Behavior of a Solder Joint Material", ASME international mechanical engineering congress & exposition, Anaheim, California, pp1-13
18. Darveaux, R., Banerji, K, 1992, "Constitutive Relations for Tin-Based Solder Joints," IEEE Trans. CHMT, Vol 13, No.4, pp929-939.
19. Dasgupta, A., Oyan, C., Barker, D., Pecht, M., 1992, "Solder Creep-Fatigue Analysis by an Energy-Partitioning Approach", Trans. ASME, J. Electronic Packaging, Vol. 114, pp. 152-160.
20. Desai, C. and Siriwardane, H. Constitutive Laws for Engineering Materials, Prentice Hall, 1994.
21. Dunstan, S., 1968, Principles of Chemistry, Van Nostrand Reinhold, New York, NY.
22. Frear, D., Morgan, H., Burchett, S., Lau, J., 1994, The Mechanics of Solder Alloy Interconnects. Chapman & Hall, New York.
23. Friedel, J., 1964, Dislocations, Pergamon Press.
24. Garafalo, F., 1965, Fundamentals of Creep and Creep-Rupture in Metals. McMillan, NY.
25. Hayakawa, K., Murakami, S., 1997, "Thermodynamical Modeling of Elastic-Plastic Damage and Experimental Validation of Damage Potential", Intl. J. of Damage Mechanics, Vol. 6, pp. 333-363.
26. Hildebrand, F., 1976, Advanced Calculus for Application, Prentice Hall
27. Ju, J. W., 1989, " On Energy-Based Coupled Elastoplastic Damage Theories: Constitutive Modeling and Computational Aspects, "International J. Solids Structures, Vol.25,No.7, pp.803-833
28. Kachanov, L.M., 1986, Introduction of Continuum Damage Mechanics. Nijhoff (Martinus), Dordrecht.
29. Kashyap, P., Murty, G.S., 1981, "Experimental Constitutive Relations for the High Temperature Deformation of a Pb-Sn Eutectic Alloy", J. Mater. Sci. Eng. 50, 205-213.
30. Krajcinovic, Dusan, 1989, "Damage Mechanics", Mechanics of Materials, 8, 117-197
31. Lemaitre, J. 1990, A Course on Damage Mechanics, second edition, Springer
32. Lemaitre, J. and Chaboche, J. L., 1990, Mechanics of Solid Materials, Cambridge University Press
33. Liang, J. Gollhardt, N. Lee, P S. Schroeder, S A. Morris, W L., 1996, "Study of fatigue and creep behaviour of four high temperature solders", Fatigue & Fracture of Engineering Materials & Structures, v 19 n 11, p 1401-1409.
34. McDowell, D.L., Miller, M.P., and Brooks, D.C., 1994, "A Unified Creep-plasticity Theory for Solder Alloys", Fatigue Testing of Electronic Materials, ASTM STP 1153, pp. 42-59.
35. Murakami, S., 1988, "Mechanical Modeling of Material Damage," ASME Journal of Applied Mechanics, Vol. 55, pp.280-286.
36. Owen, D.R.J. and Hinton, E., 1980, Finite Element in Plasticity, Pineridge Press Limited, Swansea, U.K.
37. Paydar, N., Tong, Y. and Akay, H. U., 1994, "A Finite Element Study of Factors Affecting Fatigue Life of Solder Joints", Journal of Electronic Packaging, Vol. 116, pp. 265-273.
38. Qian, Z., Ren, W., Liu, S., 1999, "A damage Coupling Framwork of Unified Viscoplasticity for the Fatigue of Solder Alloys", J. Electronic Packag. Vol.21, pp 162-168.
39. Robotnov, Y. N., 1969, "Fundamental Problems in Visco-Plasticity, " in Recent Advances in Applied Mechanics, Academic Press, New York, NY.
40. Sherby, O.D., 1962, Acta Metallurgies Vol. 10, pp. 135-147.
41. Skipor, A. F., Harren, S. V. and Botsis, J., 1996, "On the Constitutive Response of 63/37 Sn/Pb Eutectic Solder", Journal of Engineering Materials and Technology, Vol. 118, pp. 1-11.
42. Smithells, C. J., Metals Reference Book, Brandes, 6th edn., 1983.
43. Solomon, H. D. and Tolksdorf, E. D., 1996, "Energy Approach to the Fatigue of 60/40 Solder: Part II-Influence of Hold Time and Asymmetric Loading.", ASME Journal of electronic packaging, Vol. 188, pp. 67-71.
44. Solomon, H. D., 1989, "Strain-Life Behavior in 60/40 Solder", ASME Journal of Electronic Packaging, Vol. 111, pp. 75-82.
45. Solomon, H.D., 1986a. "Fatigue of 60/40 solder", IEEE Trans. Components Hybrids Manufacturing Technol. CHMT-9 (4), 423-432.
46. Solomon, H.D., 1986b. "Creep, Strain-Rate-Sensitivity and Low Cycle Fatigue of 60/40 Solder", Brazing and Soldering 11, 68-75.
47. Stolkarts, V. Keer, L M. Fine, M E., 1999, "Damage evolution governed by microcrack nucleation with application to the fatigue of 63Sn-37Pb solder," Journal of the Mechanics & Physics of Solids, v 47 n 12, p 2451-2468.
48. Stone, D.S., and Rashid, M.M. Constitutive Models Chapter 4 in The Mechanics of Solder Alloys, Interconnect, Chapman-Hall, 1994.
49. Tang, H., Basaran, C., "A Damage Mechanics Based Fatigue Life Prediction", ASME Journal of Electronic Packaging, (to appear).
50. Valanis, K.C., 1997, "Some Thoughts on Thermodynamics of Internal Variables", Arch. Mech., Vol. 49, No. 2, pp. 443-445.
51. Voyiadjis, G. Z., and Thisgarajan, G., 1996, " A Damage Cyclic Model for Metal Matrix Composites", in Damage and Interface Debonding in Composites, Voyiadjis and Allen, eds., Elsevier, New York, NY.
52. th Annual International Reliability Physics Symposium, Orlando, FL.
53. Zhao,Y., Basaran, C., Cartwright, A., and Dishongh, T., 1999. "Thermomechanical Behavior of Micron Scale Solder Joints : an Experiment Observation", Journal of the Mechanical Behavior of Materials, n10, 135-146.
54. Zhao,Y., Basaran, C., Cartwright, A., and Dishongh, T., 2000. "Thermomechanical Behavior of Micron Scale Solder Joints under Dynamic Loads", Mechanics of Materials, V32, n3, 161-173.