A fatigue theory for solders

IEEE International Reliability Physics Symposium Proceedings

Volumn 2001-January, Issue , 2001, Pages 120-127

  Wen, Shengmin ^a   Keer, L M ^a  

^a Northwestern University   (United States)

Author keywords

Anisotropic magnetoresistance; Capacitive sensors; Civil engineering; Fatigue; Micromechanical devices; Optical microscopy; Scanning electron microscopy; Soldering; Surface cracks; Testing

Indexed keywords

ANISOTROPY; CAPACITIVE SENSORS; CIVIL ENGINEERING; ENHANCED MAGNETORESISTANCE; FAILURE (MECHANICAL); FATIGUE DAMAGE; FATIGUE OF MATERIALS; OPTICAL MICROSCOPY; SCANNING ELECTRON MICROSCOPY; SOLDERING; SOLDERING ALLOYS; SOLVENTS; SURFACE DEFECTS; TESTING;

CRYSTALLOGRAPHIC ORIENTATIONS; FATIGUE FAILURE CRITERION; INDIVIDUAL GRAINS; MICROMECHANICAL DEVICE; PERCOLATION THRESHOLDS; PHYSICAL DAMAGES; SOLDER STRUCTURES; SURFACE CRACKS;

TIN;

EID: 84875472791     PISSN: 15417026     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/RELPHY.2001.922891     Document Type: Conference Paper

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