Mechanics of Pb40/Sn60 near-eutectic solder alloys subjected to vibrations

Applied Mathematical Modelling

Volumn 22, Issue 8, 1998, Pages 601-627

  Basaran, Cemal ^a   Chandaroy, Rumpa ^a  

^a the State University of New York   (United States)

Author keywords

Electronic packing; Solder joint; Vibration

Indexed keywords

ELECTRONICS PACKAGING; MATHEMATICAL MODELS; MICROELECTRONICS; SOLDERING ALLOYS; TIME DOMAIN ANALYSIS; TIN ALLOYS; VIBRATIONS (MECHANICAL);

NONLINEAR TIME DOMAIN DYNAMIC ANALYSIS;

SOLDERED JOINTS;

EID: 0032141340     PISSN: 0307904X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0307-904X(98)10059-8     Document Type: Article

References (48)

1. ABAQUS, 1996. ABAQUS version 5.6 Hibbit. Karlsson and Sorensen, Inc.
2. ADINA, 1996. ADINA Users Manual. ADINA Corp., Watertown, MA.
3. Aifantis, E.C., 1989. Plasticity and self-organization. In: Jinghang, F., Murakami, S. (Eds.), Advances in Constitutive Laws for Engineering Materials. Intern. Academic Publishers, Oxford.
4. ANSYS, 1992. ANSYS Users Manual Rev. 5. Swanson Analysis Systems, Inc., Houston, PA.
5. Bak P., Tang C. Earthquake as a self-organized critical phenomenon. J. Geophys. Res. 94(B11):1989;15635-15637.
6. Barker, D.B., Sidharth, 1995. Vibration induced fatigue life estimation of corner leads of peripheral leaded components. In: Proceedings of ASME Congress, San Francisco, CA.
7. Barker D., Vodzak J., Dasgupta A., Pecht M. Combined vibrational and thermal solder joint fatigue - A generalized strain versus life approach. Trans. ASME, J. Electronic Packag. 112:1990;129-134.
8. Basaran, C., 1996. A comparison of viscoplastic and plastic constitutive models for solder alloys. In: Suhir, E. (Ed.), Structural Analysis in Microelectronics and Fiber Optics. ASME-EEP-16, 1996, pp. 149-154.
9. Basaran, C., 1998. Unified disturbed state concept. In: Modeling to Applications in Geomechanics. Wiley, New York.
10. Basaran, C., Yan, C., 1998. A damage criterion based on entropy. In: Proceedings of the ASCE 12th Engineering Mechanics Conference, La Jolla, CA, 17-20 May.
11. Basaran, C., Yan, C. A thermodynamic framework for damage mechanics of solder alloys. J. Electronic Packag., Trans. ASME, to appear.
12. Basaran C., Desai C.S., Kundu T. Thermomechanical finite element analysis of problems in electronic packaging using the disturbed state concept. Part I: Theory and formulation. J. Electronic Packag. 120(1):1998;41-47.
13. Basaran C., Desai C.S., Kundu T. Thermomechanical finite element analysis of problems in electronic packaging using the disturbed state concept. Part II: Verification and application. J. Electronic Packag. 120(1):1998;48-54.
14. Bathe, K.J., 1996. Finite Element Procedures. Prentice-Hall, Engelwood Cliffs, NJ.
15. Blanks, H.S., 1976. Accelerated vibration fatigue testing of leadless and solder joint. In: Microelectronics and Reliability, vol. 15. Pergamon Press, Oxford, pp. 213-219.
16. Bonda, N.R., Noyan, I.C., 1996. Effect of the specimen size in predicting the mechanical properties of PbSn solder alloys. Trans. Comp. Pack. and Manuf. Tech. A 19 (2).
17. Chandaroy, R., 1998. Damage Mechanics of Solder Joints Under Combined Dynamic and Thermal Loading. Ph.D. Dissertation, Dept. of Civil Engineering, SUNY at Buffalo.
18. Clough, R.W., Penzien, J., 1993. Dynamics of Structures. McGraw-Hill, New York.
19. Coserat, E., Coserat, F., 1909. Theorie des Corps Deformables. Herman, Paris.
20. Darbha, K., Ling, S., Upadhyayula, K., Dasgupta, A., 1996. Stress Analysis of Surface-Mount Interconnects Due to Vibrational Loading, ASME, WAM, Atlanta, GA.
21. Dasgupta, A., Oyan, C., Barker, D., Pecht, M., 1992. Solder creep-fatigue analysis by an energy-partitioning approach. Trans. ASME, J. Electronic Packag. 114.
22. Desai, C.S., 1995. Constitutive modeling using the disturbed state as microstructure, self-adjustment concept. In: Muhlhaus, H.B. (Ed.), Continuum Models for Materials with Microstructure, Chap. 8. Wiley, New York.
23. Desai C.S., Chia J., Kundu T., Prince J. Thermomechanical response of materials and interfaces in electronic packaging: Part I: Unified constitutive model and calibration. J. Electronic Packag. 119(4):1997;294-300.
24. Frear, D., Morgan, H., Burchett, S., Lau, J., 1994. The Mechanics of Solder Alloy Interconnects. Chapman & Hall, New York.
25. Frear, D.R., Burchet, S.N., Rashid, M.M., 1995. A microstructurally based model of solder joints under conditions of thermomechanical fatigue. In: Advances in Electronic Packaging. ASME, EEP-Vol. 10, pp. 347-360.
26. Garafalo, F., 1965. Fundamentals of Creep and Creep-Rupture in Metals. McMillan, New York.
27. Hill, R., 1950. The Mathematical Theory of Plasticity. Oxford University Press, Oxford.
28. Ju, S.H., Kuskowski, S., Sandor, B.I., Plesha, M.E., 1994. Creep-fatigue damage analysis of solder joints. In: Schroeder, S.A., Mitchell, M.R. (Eds.), Fatigue of Electronic Materials, ASTM STP, 1153. American Society for Testing and Materials, Philadelhia, PA, pp. 1-21.
29. Kachanov, L.M., 1986. Introduction of Continuum Damage Mechanics. Nijhoff (Martinus), Dordrecht.
30. Kashyap P., Murty G.S. Experimental constitutive relations for the high temperature deformation of a Pb-Sn eutectic alloy. J. Mater. Sci. Eng. 50:1981;205-213.
31. Knecht S., Fox L.R. Constitutive relation and creep-fatigue life model for eutectic tin-lead solder. IEEE Trans. Comp. Hybr. Manuf. Tech. 13(2):1990;424-433.
32. Lau, J., Schneider, E., Baker, T., 1995. Shock and vibration of solder bumped flip chip on organic coated copper boards. In: Proceedings of the ASME International Mechanical Engineering Congress and Exposition, San Francisco, CA.
33. Markstein, H.W., 1987. Designing electronics for high vibration and shock. J. Electronic Packag. Production, Special Report, April, 40-43.
34. Miner, M.A., 1945. Cumulative damage in fatigue. J. Appl. Mech. 12 (September).
35. MIL-HDBK-304, 1964. Military Standardization Handbook Package, Cushioning Design. Department of Defense, Washington, DC.
36. Morris, J.W. Jr., Reynolds, H.L., 1992. The influence of microstructure on the mechanics of eutectic solders. EEP-Vol. 19-2, Advances in Electronic Packaging.
37. Morris, J.W., Goldstein, F.J.L., Mei, Z., 1994. Microstructural influences on mechanical properties of solder. In: Frear, D. et al. (Eds.), The Mechanics of Solder Alloy Interconnects, Chap. 2. Chapman & Hall, New York.
38. Ozmat, B., 1990. A nonlinear thermal stress analysis of surface mount solder joints. In: Proceedings of 40th Electronic Components and Technology Conference, Las Vegas, Nevada, 20-23 May.
39. Perzyna, P., 1966. Fundamental problems in visco-plasticity. In: Recent Advances in Applied Mechanics. Academic Press, New York.
40. Pitarresi, J.M., Akanda, A., 1993. Random vibration response of a surface mount lead/solder joint. In: Advances in Electronic Packaging. ASME-EEP-Vol. 4-1.
41. Sherby O.D. Acta Metallurgica. 10:1962;135-147.
42. Solomon H.D. Fatigue of 60/40 solder. IEEE Trans. Components Hybrids Manufacturing Technol. CHMT-9(4):1986;423-432.
43. Solomon H.D. Creep, strain-rate-sensitivity and low cycle fatigue of 60/40 solder. Brazing and Soldering. 11:1986;68-75.
44. Steinberg, D.S., 1988. Vibration Analysis for Electronic Equipment. Wiley, New York.
45. Stone, D.S., Rashid, M.M., 1994. Constitutive Models. In: Frear, D. et al. (Eds.), The Mechanics of Solder Alloy Interconnects, Chap. 4. Chapman & Hall, New York.
46. Suhir, E., Lee, Y.C., 1988. Thermal, mechanical, and environmental durability design methodologies. In: Electronic Materials Handbook, vol. 1. ASM International.
47. Valanis K.C. A gradient thermodynamic theory of self-organization. Acta Mechanica. 127:1998;1-23.
48. Yan, C.Y., 1997. A Damage Mechanics Based General Purpose Interface/Contact Element. Ph.D. Dissertation, Dept. of Civil, Structural and Environmental Engineering, SUNY at Buffalo.