Damage mechanics characterization on fatigue behavior of a solder joint material

American Society of Mechanical Engineers (Paper)

Volumn , Issue , 1998, Pages 1-18

  Chow, C L ^a   Yang, Fan ^a   Fang, H Eliot ^a  

^a UNIVERSITY OF MICHIGAN DEARBORN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK INITIATION; CRACK PROPAGATION; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; FRACTURE MECHANICS; MATHEMATICAL MODELS; MICROCRACKS; PLASTICITY; RELIABILITY; SOLDERED JOINTS; THERMODYNAMIC PROPERTIES;

DAMAGE MECHANICS; INTEGRITY; PLASTIC DAMAGE; THERMOMECHANICAL FATIGUE LOADING;

ELECTRONICS PACKAGING;

EID: 0032255136     PISSN: 04021215     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (39)