Implementation of a thermodynamic framework for damage mechanics of solder interconnects in microelectronics packaging

International Journal of Damage Mechanics

Volumn 11, Issue 1, 2002, Pages 87-108

  Basaran, Cemal ^a   Tang, Hong ^a  

^a UNIVERSITY AT BUFFALO   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRONICS PACKAGING; ENTROPY; EUTECTICS; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; FUNCTIONS; MATHEMATICAL MODELS; MECHANICAL TESTING; SOLDERING ALLOYS; THERMODYNAMICS; VISCOPLASTICITY;

BALL GRID ARRAY PACKAGE; CYCLIC SHEAR TESTS; DAMAGE EVOLUTION FUNCTION; DAMAGE MECHANICS; MICROELECTRONICS PACKAGING; SOLDER INTERCONNECTS; THERMOMECHANIC FATIGUE LOADS; VISCOPLASTIC MODEL;

CONTINUUM MECHANICS;

EID: 0036212370     PISSN: 10567895     EISSN: None     Source Type: Journal    
DOI: 10.1106/105678902022259     Document Type: Article

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