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Journal of Vacuum Science and Technology, Part A: Vacuum, Surfaces and Films

Volumn 19, Issue 4, 2001, Pages 1374-1378

Relationship between deprotection and film thickness loss during plasma etching of positive tone chemically amplified resists

(2) Mahorowala, A P a Medeiros, D R a

a IBM T J WATSON RESEARCH CENTER (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CATALYSIS; CORRELATION METHODS; ELECTRON BEAMS; FOURIER TRANSFORM INFRARED SPECTROSCOPY; IMAGE PROCESSING; LITHOGRAPHY; PHOTOCHEMICAL REACTIONS; POLYMERS; SHRINKAGE; ULTRAVIOLET RADIATION;

DEPROTECTION; POSITIVE TONE CHEMICALLY AMPLIFIED (CA) RESISTS;

PLASMA ETCHING;

EID: 0035394660 PISSN: 07342101 EISSN: None Source Type: Journal
DOI: 10.1116/1.1372909 Document Type: Article

Times cited : (7)

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