Recent advancements of moire and microscopic moire interferometry for thermal deformation analyses of microelectronics devices

Experimental Mechanics

Volumn 38, Issue 4, 1998, Pages 278-288

  Han, B ^a,b  

^a AMRL   (United States)

^b AIAA   (United States)

Author keywords

Coefficient of thermal expansion; Electronic packaging; Microelectronics device; Microscopic moire interferometry; Moire interferometry; Thermal deformation

Indexed keywords

DEFORMATION; ELECTRONICS PACKAGING; MICROELECTRONICS; NUMERICAL ANALYSIS; THERMAL EXPANSION;

COEFFICIENT OF THERMAL EXPANSION; MICROSCOPIC MOIRE INTERFEROMETRY; MOIRE INTERFEROMETRY; THERMAL DEFORMATION;

INTERFEROMETRY;

THERMAL ANALYSIS;

EID: 0032419716     PISSN: 00144851     EISSN: None     Source Type: Journal    
DOI: 10.1007/bf02410390     Document Type: Article

References (20)

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