Effect of underfill on C4 bumps and surface laminar circuit: an experimental study by microscopic moire interferometry

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3906, Issue , 1999, Pages 605-610

  Verma, K ^a   Kunthong, P ^a   Han, B ^a  

^a CLEMSON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEFORMATION; FLIP CHIP DEVICES; INTERFEROMETRY; MICROSTRUCTURE; NUMERICAL METHODS; RELIABILITY; SUBSTRATES; THERMAL EFFECTS; THERMAL LOAD;

BUMPS; DIRECT CHIP ATTACH PACKAGE; FLIP CHIP PITCH BALL GRID ARRAY PACKAGE; MICROSCOPIC MOIRE INTERFEROMETRY; SURFACE LAMINAR CIRCUIT; UNDERFILL;

ELECTRONICS PACKAGING;

EID: 0033328065     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)