Experimental determinations of thermal strains in semiconductor packaging using Moire interferometry

American Society of Mechanical Engineers, EEP

Volumn 2, Issue , 1992, Pages 779-784

  Guo, Y ^a   Chen, W T ^a   Lim, K C ^a  

^a IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INTERFEROMETRY; MOIRE FRINGES; SEMICONDUCTOR DEVICES; STRAIN MEASUREMENT; THERMAL STRESS;

MOIRE INTERFEROMETRY; SOLDER JOINTS; THERMAL STRAINS;

ELECTRONICS PACKAGING;

EID: 0027068646     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)