High temperature deformation of area array packages by Moire interferometry/FEM hybrid method

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1997, Pages 444-452

  Zhu, Jiansen ^a   Zou, Daqing ^a   Liu, Sheng ^a  

^a WAYNE STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEFORMATION; ENCAPSULATION; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; INTERFEROMETRY; SOLDERED JOINTS; SOLDERING; THERMAL EFFECTS;

FLIP CHIP BALL GRID ARRAY (BGA); MOIRE INTERFEROMETRY;

ELECTRONICS PACKAGING;

EID: 0030654927     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (29)