Characterization of PCB Expansion using Moiré Interferometry and the Impact of Expansion Variability on the Life of Solder Joints

American Society of Mechanical Engineers, EEP

Volumn 26 3, Issue , 1999, Pages 875-882

  Hunter, B ^a   Subbarayan, G ^b   Rose, D ^a  

^a Sun StorageTek   (United States)

^b University of Colorado at Boulder   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0347128736     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (18)

1. SIA.http://notes.sematech.org/mcpgs/roaclmap4.pdf, 1997.
2. S. S. Manson, Thermal Stress and Low-Cycle Fatigue, McGraw-Hill, 1966.
3. L. Zhang, B. Hunter, G. Subbarayan, and D. Rose, "The Accuracy of Structural Approximations Employed in Analysis of Area Array Packages", ITherm '98, pg. 269-276.
4. J.S. Corbin, "Finite Element Analysis for Solder Ball Connect (SBC) structural design optimization", IBM Journal of Research and Development, Vol. 37, pp585-596,1993.
5. A. Mertol, "Application of the Taguchi Method on the Robust Design of Molded 225 Plastic Ball Grid Array Packages", IEEE Transaction on Components, Packaging, and Manufacturing Technology - Part B, Vol. 18, No. 4, pp734-743, November 1995.
6. B. Nagaraj and M. Mahalingam, "Package to Board attach Reliability- Methodology and Case Study on Ompac Package", EEP -Vol.4-1, Advances in Electronic Packaging, ASME, pp537-543, 1993.
7. Y. Guo, C. K. Lim, W. T. Chen, C. G. Woychik, "Solder Ball Connect (SBC) Assemblies under Thermal Loading: I. Deformation Measurement via Moiré Interferometry, and its Interpretation", IBM Journal of Research and Development, Vol. 37, pp635-647, 1993.
8. D. Post, B. Han and P. Ifju, High Sensitivity Moiré, Springer-Verlag New York Inc. 1994.
9. S. M. Heinrich, S. Shakya and P. S. Lee, "Effect of Component Heterogeneity on Global CTE Mismatch Displacement in Areal-Array Solder Interconnects", Journal of Electronic Packaging, Vol. 120, Number 1, pp 12-17,March 1998.
10. S. M. Heinrich, S. Shakya and P. S. Lee, "Shearing Deformation in Partial Area Array: Analytical Results", Journal of Electronic Packaging, Vol. 120, Number 1, pp18-23, March 1998.
11. L.D. Olson, "Resins and Reinforcements", Electronic Materials Handbook, Volume 1, ASM International, 1989, p. 535
12. C. Harper and R. Sampson, Electronic Materials and Processes Handbook, McGraw-Hill, 1994, p. 2.19
13. th Ed. Volume 2, ASM International, 1979
14. S. Tsai and H. Hahn, "Introduction to Composite Materials", Technomic Publishing, 1980.
15. R. Schapery, "Thermal Expansion Coefficients of Composite Materials Based on Energy Principles", Journal of Composite Materials 2, No. 3, pp380-404, 1968.
16. T.Y. Wu, Y. Guo and W.T. Chen, "Thermal-mechanical strain characterization for printed wiring boards", IBM Journal of Research and Development, Vol. 37, pp621-634, 1993.
17. Electronic Packaging Solutions International, Inc
18. A. Despande, G. Subbarayan, and D. Rose "A System for First Order Reliability Estimation of Area Array Packages." MED-Vol 8, Proceedings of the ASME Manufacturing Science and Engineering Division - 1998, ASME, 1998.